Multi-layer patch antenna

ABSTRACT

An antenna system includes: a patch radiator being electrically conductive and configured to radiate energy in a first frequency band and a second frequency band, different from the first frequency band; a parasitic patch radiator overlapping with the patch radiator, the parasitic patch radiator being electrically conductive and being configured to radiate energy in the first frequency band; and at least one parasitic element including a conductor sized and disposed relative to the parasitic patch radiator such that a combination of the parasitic patch radiator and the at least one parasitic element will radiate energy in the second frequency band.

BACKGROUND

Wireless communication devices are increasingly popular and increasinglycomplex. For example, mobile telecommunication devices have progressedfrom simple phones, to smart phones with multiple communicationcapabilities (e.g., multiple cellular communication protocols, Wi-Fi,BLUETOOTH® and other short-range communication protocols),supercomputing processors, cameras, etc. Wireless communication deviceshave antennas to support wireless communication over a range offrequencies.

As wireless communication technology evolves from, mobile communicationdevices may be configured to communicate using multiple millimeter-wave,e.g., above 25 GHz, beams. For example, 5G devices may be configured tooperate in the 28 GHz band (26.5-29.5 GHz) and the 39 GHz band (37-40GHz). Millimeter-wave receive (Rx) beams may align with a transmit (Tx)beam of a 5G base station, that may be referred to as a gNodeB, or gNB,or a WLAN access point, or other source of communication signals. Thereceive beams may be from a Pseudo-Omni (PO) codebook (i.e., the rangeand granularity of steering angles), with a relatively large beamwidth,or may be from a narrow codebook, with a relatively small beamwidth. Toform beams of varying beamwidths (e.g., narrower beamwidth for datatransmission), different antenna array element types and arrangementsmay be used. By changing radiator array element weights (signalamplitudes and/or input feed signal phases), beams can be steered tovarious different scan angles and/or switched between a PO beam and anarrower beam.

SUMMARY

An example of an antenna system includes: a patch radiator beingelectrically conductive and configured to radiate energy in a firstfrequency band and a second frequency band, different from the firstfrequency band; a parasitic patch radiator overlapping with the patchradiator, the parasitic patch radiator being electrically conductive andbeing configured to radiate energy in the first frequency band; and atleast one parasitic element including a conductor sized and disposedrelative to the parasitic patch radiator such that a combination of theparasitic patch radiator and the at least one parasitic element willradiate energy in the second frequency band.

Implementations of such a system may include one or more of thefollowing features. A lowest frequency in the first frequency band is atleast 10% higher than a highest frequency in the second frequency band.The at least one parasitic element includes at least one conductordisposed adjacent to each edge of the parasitic patch radiator. Theparasitic patch radiator is square, configured to radiate energy in thefirst frequency band in at least one of two orthogonal polarizations,and centered relative to the patch radiator, and the at least oneparasitic element is symmetrically disposed and configured relative tothe parasitic patch radiator such that the combination of the parasiticpatch radiator and the at least one parasitic element will radiateenergy in the second frequency band in at least one of the twoorthogonal polarizations. The at least one parasitic element furtherincludes a further conductor disposed is a region diagonally adjacenteach corner of the parasitic patch radiator. The at least one parasiticelement includes a conductive loop disposed around the parasitic patchradiator.

Also or alternatively, implementations of such a system may include oneor more of the following features. The patch radiator is disposed in afirst layer of the system, and the parasitic patch radiator and the atleast one parasitic element are disposed in a second layer of thesystem, different from the first layer of the system. The parasiticpatch radiator is a first parasitic patch radiator, the system furtherincludes a second parasitic patch radiator disposed in a third layer ofthe system, the third layer being different from the first layer and thesecond layer, and the second parasitic patch radiator being configuredto radiate energy in the second frequency band. The first parasiticpatch radiator is disposed on a first side of the patch radiator and thesecond parasitic patch radiator is disposed on a second side, andoverlapping with, the patch radiator. The system includes a plurality ofparasitic elements, where the parasitic patch radiator and the pluralityof parasitic elements are disposed symmetrically about a center point.The patch radiator is one of a plurality of patch radiators disposed inan array, the parasitic patch radiator and the at least one parasiticelement are components of the array configured and disposed toparasitically couple to the plurality of patch radiators, and there aremore parasitic patches than patch radiators in the array.

An example of a multi-layer antenna system includes: a multi-layeredcircuit board; a feed line configured to convey electricity; a patchradiator coupled to the feed line, the patch radiator being electricallyconductive, having a rectangular shape, being disposed in a first layerof the multi-layered circuit board, and being configured to radiateenergy in a first frequency band and a second frequency band differentfrom the first frequency band; a parasitic patch radiator disposed in asecond layer of the multi-layered circuit board, the patch radiator andthe parasitic patch radiator overlapping, the parasitic patch radiatorbeing electrically conductive, having a rectangular shape, having afirst edge, a second edge, a third edge, and a fourth edge, each of thethird edge and the fourth edge extending between the first edge and thesecond edge and having a first electrical length between 0.4 and 0.6wavelengths, in a substrate of the multi-layered circuit board, in thefirst frequency band; and at least one parasitic element including afirst conductor disposed adjacent to the first edge of the parasiticpatch radiator and a second conductor disposed adjacent to the secondedge of the parasitic patch radiator.

Implementations of such a system may include one or more of thefollowing features. The parasitic patch radiator and the at least oneparasitic element are disposed and configured to, in combination,provide an electrical length between 0.4 and 0.6 wavelengths in thesubstrate in the second frequency band to radiate energy in the secondfrequency band, a lowest frequency in the first frequency band being atleast 10% higher than a highest frequency in the second frequency band.The the parasitic patch radiator is square, the at least one parasiticelement further includes a third conductor disposed adjacent to thethird edge of the patch radiator and a fourth conductor disposedadjacent to the fourth edge of the patch radiator, the parasitic patchradiator, the first conductor, and the second conductor are configuredto, in combination, radiate energy in the second frequency band in afirst polarization, and the parasitic patch radiator, the thirdconductor, and the fourth conductor are configured to, in combination,radiate energy in the second frequency band in a second polarizationorthogonal to the first polarization.

Also or alternatively, implementations of such a system may include oneor more of the following features. The at least one parasitic elementincludes at least four conductive strips each disposed adjacent to arespective one of the first, second, third, and fourth edges of theparasitic patch radiator. The at least one parasitic element furtherincludes square conductors each aligned with two of the four conductivestrips.

Also or alternatively, implementations of such a system may include oneor more of the following features. The at least one parasitic elementincludes a conductive ring disposed around the parasitic patch radiator.The parasitic patch radiator is a first parasitic patch radiator, andthe system further includes a second parasitic patch radiator disposedin a third layer of the multi-layered circuit board and configured toradiate energy in the second frequency band. The at least one parasiticelement is disposed in the second layer of the multi-layered circuitboard.

Another example of an antenna system includes: a multi-layered circuitboard; a feed line configured to convey electricity; a patch radiatorcoupled to the feed line, the patch radiator being electricallyconductive, being disposed in a first layer of the multi-layered circuitboard, and being configured to radiate energy at a first frequency andat a second frequency, the first frequency and the second frequencybeing separated by more than 5 GHz; and a plurality of parasitic patchesdisposed in a second layer of the multi-layered circuit board, theplurality of parasitic patches configured to receive first energy at thefirst frequency from the patch radiator and to re-radiate at least aportion of the first received energy at the first frequency, andconfigured to receive second energy at the second frequency from thepatch radiator and to re-radiate at least a portion of the secondreceived energy at the second frequency.

Implementations of such a system may include one or more of thefollowing features. The plurality of parasitic patches are symmetricabout a center point. The plurality of parasitic patches include foursquare patches each partially overlapping the patch radiator. The centerpoint is a center point of the patch radiator. The first frequency isseparated from the second frequency by approximately 11 GHz.

Another example of an antenna system includes: feed means for providinga first signal in a first frequency band and a second signal in a secondfrequency band; first radiating means, electrically coupled to the feedmeans, for radiating, in the first frequency band, the first signalreceived from the feed means, and for radiating, in the second frequencyband, the second signal received from the feed means; second radiatingmeans for parasitically receiving the first signal from the firstradiating means and radiating, in the first frequency band, the firstsignal in the first frequency band; and third radiating means forparasitically receiving, in combination with the second radiating means,the second signal in the second frequency band and for radiating, incombination with the second radiating means, the second signal in thesecond frequency band.

Implementations of such a system may include one or more of thefollowing features. The third radiating means are for parasiticallyreceiving, in combination with the second radiating means, the secondsignal in the second frequency band from the first radiating means. Alowest frequency in the first frequency band is at least 10% higher thana highest frequency in the second frequency band. The second radiatingmeans and the third radiating means are disposed in a first layer of amulti-layer circuit board. The system may include fourth radiating meansfor parasitically receiving the second signal in the second frequencyband from the first radiating means and for radiating the second signalin the second frequency band, where the fourth radiating means aredisposed in a second layer, different from the first layer, of themulti-layer circuit board. The second radiating means are for radiatingthe first signal in two orthogonal polarizations, and the thirdradiating means are symmetrically disposed about the second radiatingmeans and are for, in combination with the second radiating means,radiating the second signal in the two orthogonal polarizations.

An example of a dual-band, dual-polarization antenna system includes: amulti-layered circuit board; a plurality of feed lines configured toconvey electricity; a patch radiator coupled to the plurality of feedlines, the patch radiator being electrically conductive, having a squareshape, being disposed in a first layer of the multi-layered circuitboard, and shaped to radiate energy in a first frequency band ofdifferent polarizations in response to receiving energy in the firstfrequency band from the plurality of feed lines and shaped to radiateenergy in a second frequency band of different polarizations in responseto receiving energy in the second frequency band from the plurality offeed lines, the second frequency band being different from the firstfrequency band; a parasitic patch radiator disposed in a second layer ofthe multi-layered circuit board, the patch radiator and the parasiticpatch radiator overlapping, the parasitic patch radiator beingelectrically conductive, and having a square shape with each edge havinga length between 0.4 wavelengths and 0.6 wavelengths of energy in thefirst frequency band in the multi-layered circuit board; and at leastone parasitic element disposed in the second layer of the multi-layeredcircuit board, the at least one parasitic element comprising conductivematerial disposed adjacent to at least two orthogonal edges of the patchradiator; where a cumulative length of the patch radiator and the atleast one parasitic element, measured parallel to any edge of theparasitic patch radiator, is between 0.4 wavelengths and 0.6 wavelengthsof energy in the second frequency band in the multi-layered circuitboard.

Implementations of such a system may include one or more of thefollowing features. A lowest frequency in the first frequency band is atleast 10% higher than a highest frequency in the second frequency band.The at least one parasitic element includes at least four conductivestrips each disposed adjacent to a respective edge of the parasiticpatch radiator. The at least one parasitic element further includessquare conductors each aligned with two of the four conductive strips.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a communication system.

FIG. 2 is an exploded perspective view of simplified components of amobile device shown in FIG. 1.

FIG. 3 is a top view of a printed circuit board, shown in FIG. 2,including antennas.

FIG. 4 is a top view of an example patch radiator system shown in FIG.3.

FIG. 5 is a side view of the patch radiator system shown in FIG. 4.

FIG. 6 is a top view of an alternative patch radiator system with a loopparasitic element.

FIGS. 7-8 are top views of further alternative patch radiator systemswith further parasitic elements.

FIG. 9 is a side view of another example patch radiator system.

FIG. 10 is a top view of the patch radiator system shown in FIG. 9.

FIG. 11 is a block flow diagram of a method of parasitically receivingand re-radiating signals of different frequency bands.

DETAILED DESCRIPTION

Techniques are discussed herein for arranging non-radiating metal in amulti-layer antenna. For example, a patch antenna may be drivendifferent frequency signals, and may be driven to radiate in multiplepolarizations, e.g., two polarizations for each different frequencysignal. For example, a patch antenna may be driven with a horizontalpolarization signal (on H-pol feed) and a vertical polarization signal(on V-pol feed), both in a lower frequency (e.g., a 28 GHz band) and ina higher frequency (e.g., a 39 GHz band). The driven patch radiatesenergy in the lower frequency and the higher frequency in bothpolarizations, and at least the energy in the higher frequency couplesto a parasitic patch radiator that is disposed in a different layer thanthe patch antenna and that overlaps the patch antenna. The parasiticpatch radiator receives the energy of the higher frequency from thepatch antenna and re-radiates the energy at the higher frequency. Atleast one parasitic element is configured (e.g., sized, shaped, etc.)and disposed to work in conjunction with the parasitic patch radiator toreceive energy of the lower frequency from the patch antenna andre-radiate energy of the lower frequency. For example, the parasiticpatch radiator may be resonant at the higher frequency and the parasiticpatch radiator in combination with the at least one parasitic element isresonant at the lower frequency. Other configurations, however, may beused.

Items and/or techniques described herein may provide one or more of thefollowing capabilities, as well as other capabilities not mentioned.Multiple bands of signals may be radiated using a compact antennaconfiguration, e.g., using a radiating patch antenna in conjunction witha parasitic patch radiator and at least one parasitic element. Signalsin multiple millimeter-wave frequency bands may be radiated from a thin,multi-layered antenna structure. A parasitic patch radiator may beresonant in one frequency band and may form a portion of a radiator thatis resonant in a different frequency band. Bandwidth may be broadened inone or more bands, e.g., in one or more millimeter-wave bands (e.g., 28GHz band and 39 GHz band) compared to other antenna configurations.Other capabilities may be provided and not every implementationaccording to the disclosure must provide any, let alone all, of thecapabilities discussed. Further, it may be possible for an effect notedabove to be achieved by means other than that noted, and a noteditem/technique may not necessarily yield the noted effect.

Referring to FIG. 1, a communication system 10 includes mobile devices12, a network 14, a server 16, and access points (APs) 18, 20. Thesystem 10 is a wireless communication system in that components of thesystem 10 can communicate with one another (at least some times usingwireless connections) directly or indirectly, e.g., via the network 14and/or one or more of the access points 18, 20 (and/or one or more otherdevices not shown, such as one or more base transceiver stations). Forindirect communications, the communications may be altered duringtransmission from one entity to another, e.g., to alter headerinformation of data packets, to change format, etc. The mobile devices12 shown are mobile wireless communication devices (although they maycommunicate wirelessly and via wired connections) including mobilephones (including smartphones), a laptop computer, and a tabletcomputer. Still other mobile devices may be used, whether currentlyexisting or developed in the future. Further, other wireless devices(whether mobile or not) may be implemented within the system 10 and maycommunicate with each other and/or with the mobile devices 12, network14, server 16, and/or APs 18, 20. For example, such other devices mayinclude internet of thing (IoT) devices, medical devices, homeentertainment and/or automation devices, etc. The mobile devices 12 orother devices may be configured to communicate in different networksand/or for different purposes (e.g., 5G, Wi-Fi communication, multiplefrequencies of Wi-Fi communication, satellite positioning, one or moretypes of cellular communications (e.g., GSM (Global System for Mobiles),CDMA (Code Division Multiple Access), LTE (Long-Term Evolution), etc.).The mobile device 12 is commonly referred to as a user equipment (UE) inUMTS (Universal Mobile Telecommunications System) applications, but mayalso be referred to as a mobile station (MS), a subscriber station, amobile unit, a subscriber unit, a wireless unit, a remote unit, a mobiledevice, a wireless device, a wireless communications device, a remotedevice, a mobile subscriber station, an access terminal (AT), a mobileterminal, a wireless terminal, a remote terminal, a handset, a terminal,a user agent, a mobile client, a client, or some other suitableterminology.

Referring to FIG. 2, an example of one of the mobile devices 12 shown inFIG. 1 includes a top cover 52, a display layer 54, a printed circuitboard (PCB) layer 56, and a bottom cover 58. The mobile device 12 asshown may be a smartphone or a tablet computer but the discussion is notlimited to such devices. The top cover 52 includes a screen 53. The PCBlayer 56 includes one or more antennas configured to facilitatebi-directional communication between mobile device 12 and one or moreother devices, including other wireless communication devices. Thebottom cover 58 has a bottom surface 59 and sides 51, 57 of the topcover 52 and the bottom cover 58 provide an edge surface. The top cover52 and the bottom cover 58 may comprise a housing that retains thedisplay layer 54, the PCB layer 56, and other components of the mobiledevice 12 that may or may not be on the PCB layer 56. For example, thehousing may retain (e.g., hold, contain) antenna systems, front-endcircuits, an intermediate-frequency circuit, and a processor discussedbelow. Further, the size and/or shape of the PCB layer 56 may not becommensurate with the size and/or shape of either of the top or bottomcovers or otherwise with a perimeter of the device. For example, the PCBlayer 56 may have a cutout to accept a battery. Those of skill in theart will therefore understand that embodiments of the PCB layer 56 otherthan those illustrated may be implemented.

Referring also to FIG. 3, an example of the PCB layer 56 includes a mainportion 60 and two antenna systems 62, 64. In the example shown, theantenna systems 62, 64 are disposed at opposite ends 63, 65 of the PCBlayer 56, and thus, in this example, of the mobile device 12 (e.g., ofthe housing of the mobile device 12). The main portion 60 may comprise aPCB 66 that includes front-end circuits 70, 72 (also called a radiofrequency (RF) circuit), an intermediate-frequency (IF) circuit 74, anda processor 76. The front-end circuits 70, 72 are configured to providesignals to be radiated to the antenna systems 62, 64 and to receive andprocess signals that are received by, and provided to the front-endcircuits 70, 72 from, the antenna systems 62, 64. The front-end circuits70, 72 are configured to convert received IF signals from the IF circuit74 to RF signals (amplifying with a power amplifier as appropriate), andprovide the RF signals to the antenna systems 62, 64 for radiation. Thefront-end circuits 70, 72 are configured to convert RF signals receivedby the antenna systems 62, 64 to IF signals (e.g., using a low-noiseamplifier and a mixer) and to send the IF signals to the IF circuit 74.The IF circuit 74 is configured to convert IF signals received from thefront-end circuits 70, 72 to baseband signals and to provide thebaseband signals to the processor 76. The IF circuit 74 is alsoconfigured to convert baseband signals provided by the processor 76 toIF signals, and to provide the IF signals to the front-end circuits 70,72. The processor 76 is communicatively coupled to the IF circuit 74,which is communicatively coupled to the front-end circuits 70, 72, whichare communicatively coupled to the antenna systems 62, 64, respectively.

The antenna systems 62, 64 may be formed as part of the PCB layer 56 ina variety of manners. In FIG. 3, dashed lines 71, 73 separating theantenna systems 62, 64 from the PCB 66 indicate functional separation ofthe antenna systems 62, 64 (and the components thereof) from otherportions of the PCB layer 56. The antenna systems 62, 64 may be integralwith the PCB 66, being formed as integral components of the PCB 66 ormay be separate from, but attached to, the PCB 66. Alternatively, one ormore components of the antenna system 62 and/or the antenna system 64may be formed integrally with the PCB 66, and one or more othercomponents may be formed separate from the PCB 66 and mounted to the PCB66, or otherwise made part of the PCB layer 56. Alternatively, each ofthe antenna systems 62, 64 may be formed separately from the PCB 66 andmounted to the PCB 66 and coupled to the front-end circuits 70, 72,respectively. In some embodiments, one or both of the front-end circuits70, 72 are implemented with the antenna system 62 or 64 in a module andcoupled to the PCB 66. For example, the module may be mounted to the PCB66 or may be spaced from the PCB 66 and coupled thereto, for exampleusing flexible cable or a flexible circuit. The antenna systems 62, 64may be configured similarly to each other or differently from eachother. For example, one or more components of either of the antennasystems 62, 64, may be omitted. As an example, the antenna system 62 mayinclude 4G and 5G radiators while the antenna system 64 may not include(may omit) a 5G radiator. In other examples, an entire one of theantenna systems 62, 64 may be omitted or may be configured for use witha non-cellular technology such as a WLAN technology.

A display 61 (see FIG. 2) of the display layer 54 may roughly cover thesame area as the PCB 66 and serve as a system ground plane for theantenna systems 62, 64 (and possibly other components of the device 12).The display 61 is disposed below the antenna system 62 and above theantenna system 64 (with “above” and “below” being relative to the mobiledevice 12, i.e., with a top of the mobile device 12 being above othercomponents regardless of an orientation of the device 12 relative to theEarth).

The antenna systems 62, 64 may be configured to transmit and receivemillimeter-wave energy. The antenna systems 62, 64 may be configured tosteer to different scan angels and/or to change size of beamwidth, e.g.,between a PO beam and a narrower beam.

Here, the antenna systems 62, 64 are configured similarly, with multipleradiators to facilitate communication with other devices at variousdirections relative to the mobile device 12. In the example of FIG. 3,the antenna system 62 includes an array 80 of patch radiator systems andan array 82 of dipole radiators. In other examples, one or more antennasystems may include one or more dipole radiators only, one or more patchradiators only, or a combination of one or more dipole radiators and oneor more patch radiators. In other examples, one or more other types ofradiators may be used alone or in combination with one or more dipoleradiators and/or one or more patch radiators. The patch radiators areconfigured to radiate signals primarily to, and receive signalsprimarily from, above and below a plane of the PCB layer 56, i.e., intoand out of the page showing FIG. 3. The dipole radiators are configuredto radiate signals primarily to, and receive signals primarily from,sides of the PCB layer 56, with the dipole radiators in the antennasystem 62 configured to radiate primarily to the top and left of the PCBlayer 56 as shown in FIG. 3 and the dipole radiators in the antennasystem 64 configured to radiate primarily to the right and bottom of thePCB layer 56 as shown in FIG. 3. Positioning the antenna systems 62, 64in or near corners of the PCB layer 56 may help provide spatialdiversity (directions relative to the mobile device 12 to which signalsmay be transmitted and from which signals may be received), e.g., tohelp increase MIMO (Multiple Input, Multiple Output) capability.Further, the array 82 of patch radiators may be configured to providedual polarization radiation and reception.

Referring also to FIGS. 4-5, an example of a patch radiator system 110,of the array 80 of patch radiator systems of the antenna system 62 shownin FIG. 3, is shown, with FIG. 4 being a top view of the system 110 andFIG. 5 being a side view of the system 110. The patch radiator system110 includes a multi-layered circuit board 111 that includes a high-bandpatch 112, parasitic elements 114, 115, 116, 117, a radiating patch 118,a low-band patch 120, a horizontal polarization feed 122, a verticalpolarization feed 124, a ground plane 128, and a substrate 130. Theparasitic elements 114-117 may be considered as parasitic patches. Thepatch radiator system 110 is configured as a dual-band,dual-polarization radiator system. Being configured fordual-polarization radiation is not required, and one or more features inthe system 110 may instead be configured to single-polarizationradiation (e.g., a single feed may be used and/or one or more patches orother items sized and shaped for single polarization radiation at thefrequency of signals to be transmitted and/or received). In the exampleshown, however, items are configured and provided for dual-polarizationradiation. In particular, the system 110 may radiate in either or bothof two orthogonal polarizations for two different 5G communicationbands, e.g., due to orthogonal edges of radiators (e.g., patchradiators, parasitic radiators). For example, the system 110 may beconfigured to radiate in different, here orthogonal, polarizations inboth the 28 GHz band and the 39 GHz band. In FIG. 5, the parasiticelement 117 is not shown for clarity. The radiating patch 118, thelow-band patch 120, and the ground plane 128 are disposed in differentlayers in the system within the substrate 130. The high-band patch 112and the parasitic elements 114-117 are disposed in the same layer of thesystem 110, here, on top of the substrate 130. As shown in FIG. 5, withthe system 110 oriented as shown, the high-band patch 112 is disposedabove the radiating patch 118 (i.e., on a side of the patch 118 oppositethe ground plane 128) and the low-band patch 120 is disposed below theradiating patch 118 (i.e., on the same side of the radiating patch 118as the ground plane 128, such that the low-band patch 120 is disposedbetween the radiating patch 118 and the ground plane 128).

The feeds 122, 124 (also referred to as feed lines) are configured toconvey electricity to provide signals to the radiating patch 118. Eachof the feeds 122, 124 is configured to provide signals of differentfrequencies, here in the 28 GHz and 39 GHz band to the radiating patch118. The feeds 122, 124 are electrically coupled to the radiating patch118 in appropriate locations to excite the radiating patch 118 toradiate respective polarizations of signals in response to receivingsignals from the feeds 122, 124. Here, the horizontal polarization feed122 is coupled to the radiating patch 118 to excite the radiating patch118 to radiate horizontally-polarized signals of frequenciescorresponding to the frequencies of the energy of the signals providedby the feed 122. Also, the vertical polarization feed 124 is coupled tothe radiating patch 118 to excite the radiating patch 118 to radiatevertically-polarized signals of frequencies corresponding to thefrequencies of the energy of the signals provided by the feed 124. Thefeeds 122, 124 receive signals to be provided to the radiating patch 118from transmission lines, e.g., striplines with the ground plane 128being a top portion of the striplines (with remaining portions notshown). The feeds pass through, and do not make electrical contact with,the low-band patch 120.

The radiating patch 118 is electrically conductive (e.g., a conductormade of electrically conductive material), electrically coupled to thefeeds 122, 124, and configured to radiate signals received from thefeeds 122, 124. There may be some loss of some of the energy in a signalreceived from either of the feeds 122, 124 during transmission, but theradiating patch 118 will radiate sufficient energy to convey a signalcorresponding to the information received, i.e., characteristics of theradiated signal will correspond to characteristics of the receivedsignal. As shown, the radiating patch 118 is rectangular, here square,such that the radiating patch 118 may radiate signals in either or bothof two orthogonal polarizations from respective edges of the radiatingpatch 118. The radiating patch 118 is sized to radiate energy in a highfrequency band, e.g., and the 39 GHz band (37-40 GHz). For example, eachedge of the radiating patch 118 may have an electrical length between0.4 and 0.6 wavelengths, in the substrate 130, in the 39 GHz band. Herethe edges of the radiating patch 118 are straight, but otherconfigurations may be used (e.g., with slots extending inwardly from anotherwise straight edge). The radiating patch 118 is also configured tocouple energy in a low frequency band, e.g., the 28 GHz band (26.5-29.5GHz) to the low-band patch 120. A lowest frequency in the high frequencyband may be at least 10% higher than a highest frequency in the lowfrequency band.

The high-band patch 112 is electrically conductive and configured anddisposed to parasitically receive a high-band signal in a high frequencyband and to re-radiate the high-band signal in the high frequency band(e.g., the 39 GHz band). The high-band patch 112 may be called aparasitic patch. The high-band patch 112 parasitically receives thehigh-band signal from the radiating patch 118 in that the high-bandpatch 112 wirelessly couples to and receives the high-band signal fromenergy radiated by the radiating patch 118. The high-band patch 112re-radiates one or more signals in response to receiving the one or moresignals from the radiating patch 118. The re-radiated high-band signalmay have less energy than the received high-band signal but remains thesame signal in content. The high-band patch 112 is disposed overlappingthe radiating patch 118 to facilitate reception by the high-band patch112 of the high-band signal radiated by the radiating patch 118. Asshown, the high-band patch 112 is centered over the radiating patch 118,with edges 113 of the high-band patch 112 parallel with edges 119 of theradiating patch 118, and the entire high-band patch 112 overlaps theradiating patch 118, although other arrangements may be used (e.g., onlypartially overlapping the radiating patch 118, the edges 113 of thehigh-band patch 112 not parallel to the edges 119 of the patch 118,etc.). The high-band patch 112 is rectangular, here square, with edgelengths sized for radiating signals in the high band, e.g., in the 39GHz band. The high-band patch 112 has edge lengths 131 that are slightlysmaller than edge lengths 133 of the radiating patch 118, which may thusbetter (e.g., more efficiently) radiate signals in the high band thanthe radiating patch 118. The electrical length, here the edge length131, of each edge of the high-band patch 112 may be between 0.4 and 0.6wavelengths, in the substrate 130, of the frequencies in the highfrequency band. Here, the edges of the high-band patch 112 are straightand thus the physical length corresponds to the electrical length. Otherconfigurations, however, may be used, e.g., with one or morenon-straight edges (e.g., with slots extending inwardly from an edge).Other examples of high-band patches may not be square, e.g., beingrectangular but with two different edge lengths. This may facilitateradiation in different frequency bands.

The parasitic elements 114-117 are configured and disposed toparasitically receive a low-band signal in combination with thehigh-band patch 112. That is, the parasitic elements 114-117 areconfigured and disposed such that the combination of the high-band patch112 and the parasitic elements 114-117 will parasitically receive thelow-band signal (in a low frequency band) from the radiating patch 118.While four parasitic elements are shown, this is an example and otherquantities (e.g., one, two, three, or more than four) of parasiticelements may be used. The combination of the high-band patch 112 and theparasitic elements 114-117 is configured to re-radiate the low-bandsignal in the low frequency band (e.g., the 28 GHz band). Thecombination of the high-band patch 112 and the parasitic elements114-117 re-radiates one or more signals in response to receiving the oneor more signals from the radiating patch 118. The combination of thehigh-band patch 112 and the parasitic elements 114-117 parasiticallyreceives the low-band signal from the radiating patch 118 in that thehigh-band patch 112 and the parasitic elements 114-117 are notphysically coupled to the radiating patch 118 (or either of the feeds122, 124), but wirelessly couples to and receives the low-band signalfrom energy radiated by the radiating patch 118. The re-radiatedlow-band signal may have less energy than the received low-band signalbut remains the same signal in content.

Each of the parasitic elements 114-117 is disposed adjacent to, i.e.,near but a non-zero distance from, a corresponding edge of the high-bandpatch 112. An amount of separation between the high-band patch 112 andeach of the parasitic elements 114-117 may be selected to providedesired performance of the system 110. The separation selected may be atradeoff between low-band performance and high-band performance (e.g.,return loss), with smaller separations increasing low-band performanceand decreasing high-band performance and larger separations increasinghigh-band performance and decreasing low-band performance. In theexample shown in FIGS. 4-5, the separation between the high-band patch112 and the parasitic elements 114-117 is enough that the parasiticelements 114-117 do not overlap with the radiating patch 118, but issmall enough that the parasitic elements 114-117 do overlap partiallywith the low-band patch 120. This separation is an example only andother separations may be used. The parasitic elements 114-117 aresymmetrically disposed about the radiating patch 118 in the exampleshown in FIGS. 4-5. Also, in the example shown in FIGS. 4-5, theparasitic elements 114-117 have lengths that are slightly longer thanthe lengths of the corresponding edges of the high-band patch 112.Alternatively, the parasitic elements 114-117 could have the samelengths as the corresponding edges of the high-band patch 112, with endsof the parasitic elements 114-117 being collinear with respective edgesof the high-band patch 112. In this example shown in FIGS. 4-5, theparasitic elements 114-117 are all separated from the high-band patch112 by the same amount and have equal widths, although otherconfigurations (e.g., unequal separations and/or unequal widths) couldbe used.

The parasitic elements 114-117 are sized and shaped to helpparasitically receive and re-radiate signals in the low frequency band.Each of the parasitic elements 114-117 has an electrical width (in thisexample, a width 132) such that a combined distance of the electricalwidth (here, of the width 132) of two of the parasitic elements 114-117and the electrical length (here, the length 131) of a corresponding edgeof the high-band patch 112 between the two parasitic elements 114-117 isabout half of a wavelength of the low-band signal. For example, thisdistance (here, a cumulative length of the length 131 plus twice thewidth 132) may be between 0.4 and 0.6 wavelengths, in the substrate 130,of the frequencies in the low frequency band.

The low-band patch 120 is configured and disposed to parasiticallyreceive the low-band signal in the low frequency band and re-radiate thelow-band signal in the low frequency band. The low-band patch 120 isthus a parasitic patch. The low-band patch 120 parasitically receivesthe low-band signal from the radiating patch 118 in that the low-bandpatch 120 is not conductively coupled to radiating patch 118 (or eitherof the feeds 122, 124), but wirelessly couples to and receives thelow-band signal from energy radiated by the radiating patch 118. There-radiated low-band signal from the low-band patch 120 may have lessenergy than the received low-band signal but remains the same signal incontent. The re-radiated low-band signal from the low-band patch 120 maybe received and re-radiated by the combination of the high-band patch112 and the parasitic elements 114-117. The low-band patch 120 isdisposed overlapping the radiating patch 118 to facilitate reception bythe low-band patch 120 of the low-band signal radiated by the radiatingpatch 118. As shown, the low-band patch 120 is centered over theradiating patch 118, with edges 121 of the low-band patch 120 parallelwith the edges 119 of the radiating patch 118, and the entire radiatingpatch 118 being overlapped by the low-band patch 120, although otherarrangements may be used (e.g., only partially overlapping the radiatingpatch 118, the edges 121 of the low-band patch 120 not parallel to theedges 119 of the patch 118, etc.). In this example, the low-band patch120 is rectangular, here square, with electrical edge lengths sized forradiating signals in the low band, e.g., in the 28 GHz band. Thelow-band patch 120 has electrical edge lengths, here edge lengths 134,that are longer than the electrical edge lengths, here the edge lengths133, of the radiating patch 118, which may thus better (e.g., moreefficiently) radiate signals in the low band than the radiating patch118. The electrical edge length of each edge of the low-band patch 120may be between 0.4 and 0.6 wavelengths, in the substrate 130, of thefrequencies in the low frequency band. Other examples of low-bandpatches may not be square, e.g., being rectangular but with twodifferent edge lengths. This may facilitate radiation in differentfrequency bands.

Other Configurations

The examples discussed above are non-exhaustive examples and numerousother configurations may be used. The discussion below is directed tosome of such other configurations, but is not exhaustive either (byitself or when combined with the discussion above).

Other configurations of parasitic elements or a parasitic element may beused. Referring to FIG. 6, an example of a patch radiator system 150, ofthe array 80 of patch radiator systems of the antenna system 62 shown inFIG. 3, includes a high-band patch 152 and a single parasitic element154, with FIG. 6 being a top view of the system 150. The system 150includes a radiating patch and may include other features (e.g., alow-band patch) similar to the system 110 shown in FIGS. 4-5), but thesefeatures are not shown in FIG. 6 for simplicity of the figure. Thesystem 150 includes the single parasitic element 154 instead of theparasitic elements 114-117 shown in FIG. 4. The parasitic element 154 isa loop disposed around the high-band patch 152. Here, the loop is asquare conductive ring although other shapes may be used.

Referring to FIG. 7, which is a top view, another example of a patchradiator system 160 includes the high-band patch 112, the parasiticelements 114, 115, 116, 117, the radiating patch 118, the low-band patch120, the horizontal polarization feed 122, and the vertical polarizationfeed 124 as shown in FIG. 4, and also includes further parasiticelements 164, 165, 166, 167. The parasitic elements 164-167 are disposeddiagonally adjacent to the high-band patch 112 in corners of the system160, with each of the parasitic elements 164-167 aligned with two of theparasitic elements 114-117 that are, here, conductive strips. The use ofthe parasitic elements 164-167 may further improve radiation (e.g.,lower insertion loss compared to not using the parasitic elements164-167) by the system 160 in a lower frequency band, e.g., where aquarter wavelength in the lower frequency band is about equal to a widthof the high-band patch 112 and two widths of one of the parasiticelements 114-117. In this example, the further parasitic elements164-167 are square conductors. Using parasitic elements may also improveimpedance match from the feeds into the radiating patch.

Referring to FIG. 8, which is a top view, another example of a patchradiator system 170 includes a parasitic patch 172, parasitic elements174, 175, 176, 177, a radiating patch 178, a horizontal polarizationfeed 180, a vertical polarization feed 182, and further parasiticelements 184, 185, 186, 187. In this example, the parasitic elements174-177 are conductive strips each disposed in close proximity with arespective edge of the parasitic patch 172 and each having a lengthsimilar (here, equal) to the length of the respective edge of theparasitic patch 172. Each of the parasitic elements 184-187 is disposedin a respective corner of the system 170 and aligned with a respectivepair of the parasitic elements 174-177. The parasitic patch 172 issmaller than the radiating patch 178. The radiating patch 178 completelyoverlaps the parasitic patch 172, partially overlaps each of theparasitic elements 174-177, and partially overlaps each of the parasiticelements 184-187. The parasitic patch 172 is sized to radiate energyprimarily in a desired frequency band (e.g., has electrical edge lengthsbetween 0.4 wavelengths and 0.6 wavelengths, in a substrate of thesystem 170, of frequencies in the desired frequency band). The parasiticelements 174-177, 184-187 are sized, shaped, and disposed such that acombination of the parasitic patch 172 and the parasitic elements174-177, 184-187 re-radiate energy received from the radiating patch 178primarily in the desired frequency band.

Still other configurations are possible. For example, in the patchradiator system 170, and/or in other configurations, a low-band patch(such as the low-band patch 120 shown in FIGS. 4-5) may be omitted.

Referring to FIGS. 9 and 10, which are side and top views, respectively,another example of a patch radiator system 210 includes a radiatingpatch 212, parasitic patches 214, 215, 216, 217, a feed 220, a substrate222, and a ground plane 224. In this example, the radiating patch 212may be configured to radiate signals, provided through the feed 220, ofmultiple frequency bands or of multiple frequencies across a wide band,for example a band of 5 GHz or more (e.g., 11 GHz). Here, each of theparasitic patches 214-217 is square, and there are four parasiticpatches, although other shapes (e.g., non-square rectangles, hexagons,etc.) and/or quantities of parasitic patches may be used. The parasiticpatches 214-217 are configured (e.g., sized and shaped) and disposed toparasitically receive signals from the radiating patch 212 and tore-radiate energy in the multiple frequency bands.

In an example, the patch radiator system 210 is configured to radiatesignals of multiple frequency bands and each of the parasitic patches214-217 may have a length 230 (and width) of a length to facilitateradiation at a higher frequency band, e.g., above 50 GHz such as in a 60GHz band. For example, the length 230 may be about a half of awavelength (e.g., between 0.4 and 0.6 wavelengths) of a higher frequencysignal fed to and radiated by the radiating patch 212. Each of theparasitic patches 214-217 may be separated from adjacent ones of theparasitic patches 214-217 by a gap length 232 such that an array length234 of adjacent ones of the parasitic patches 214-217 and the gap length232 is of a length that facilitates radiation of signals of a lowerfrequency, e.g., in the 28 GHz band. For example, the array length 234may be about a half of a wavelength (e.g., between 0.4 and 0.6wavelengths) of a lower frequency signal fed to and radiated by theradiating patch 212. The gap length 232 is sized such that adjacent onesof the parasitic patches 214-217 can operate in combination to radiatelower-frequency signals while permitting individual ones of theparasitic patches to radiate higher-frequency signals. As shown, theparasitic patches are disposed overlapping the patch radiator 212,centered over the patch radiator 212, and symmetrically disposed about acenter point 236, which is also the center point of the patch radiator212. The radiating patch 212 may similarly be configured to radiate inthe higher and lower frequency bands, for example being sized as amultiple or fraction of a plurality of wavelengths of signals fortransmission or reception.

In another example, the parasitic patches are configured to re-radiateenergy over a wide frequency band. For example, the parasitic patches214-217 may be sized to re-radiate energy over a frequency band from 28GHz to 39 GHz or from 57 GHz to 68 GHz, e.g., with a return loss below athreshold return loss (e.g., −5 dB, or −10 dB) over the band. The sizeof the parasitic patches 214-217 and the gaps 240, 242 between theparasitic patches 214-217 may be adjusted to affect radiation by theparasitic patches 214-217, e.g., return loss as a function of frequency.For example, sizes of the gaps 240, 242 may affect the amount ofradiation as a function of frequency and the patch radiator system 210may be configured to effectively radiate signals over a frequency bandof 11 GHz or more. In some such embodiments, rather than each individualparasitic patch being configured to radiate a signal at the lower end ofthe frequency band, two or more of the parasitic patches 214-217 may beconfigured to radiate at all of the frequencies in the band incombination.

Referring to FIG. 11, with further reference to FIGS. 1-10, a method 250of parasitically receiving and re-radiating signals of differentfrequency bands includes the stages shown. The method 250 is, however,an example only and not limiting. The method 250 may be altered, e.g.,by having stages added, removed, rearranged, combined, performedconcurrently, and/or having single stages split into multiple stages.For example, stages 254 and 256 may be performed before, after, orconcurrently with stages 258 and 260, e.g., for use generally or for usein carrier-aggregation techniques. Still other alterations to the method250 as shown and described are possible.

At stage 252, the method 250 includes radiating a high-band signal in afirst frequency band from a radiating patch and a low-band signal in asecond frequency band from the radiating patch. For example, the feeds122, 124 may convey respective high-band signals to the radiating patch118 that radiates the high-band signals from the feeds 122, 124 inrespective polarizations. As another example, only one of the feeds 122,124 may convey a high-band signal to the radiating patch 118. As anotherexample, one of the feeds 122, 124 may convey a high-band signal to theradiating patch 118 while the other of the feeds 122, 124 mayconcurrently convey a low-band signal to the radiating patch 118. Asanother example, the feeds 122, 124 may convey low-band signals to theradiating patch 118 that radiates the low-band signals from the feeds122, 124 in respective polarizations. As another example, only one ofthe feeds 122, 124 may convey a low-band signal to the radiating patch118. The high-band signals and the low-band signals will typically beprovided to the feeds 122, 124 at different times, and the feeds 122,124 will each typically be fed only one signal at a time, but differentsignals may be provided to either of the feeds 122, 124 concurrently.The signals conveyed to the radiating patch 118 by the feeds 122, 124may be the same signals or may be different signals (e.g., havedifferent content), even if the signals are of the same frequency band.

At stage 254, the method 250 includes parasitically receiving thehigh-band signal by a high-band patch. For example, energy of thehigh-band signal radiated by the radiating patch 118 may be received bythe high-band patch 112. As the high-band patch 112 receives thehigh-band signal wirelessly, the high-band patch 112 parasiticallyreceives the high-band signal. The high-band patch 112 receives thehigh-band signal even though the high-band patch 112 receives less thanall of the energy of the high-band signal radiated by the radiatingpatch 118.

At stage 256, the method 250 includes re-radiating the high-band signalfrom the high-band patch. For example, the high-band patch 112 radiatesenergy due to receiving the high-band signal, and thus re-radiates thehigh-band signal although the high-band patch 112 radiates less than allof the energy of the high-band signal that the high-band patch 112received from the radiating patch 118. The high-band patch 112 isconfigured (e.g., shaped and arranged) to re-radiate high-band energy ineach of the high-band polarizations radiated by the radiating patch 118.As other examples, the high-band patch 152 or the parasitic patch 172re-radiates high-band signal energy received from the radiating patch118.

At stage 258, the method 250 includes parasitically receiving thelow-band signal by a combination of the high-band patch and at least oneparasitic element. For example, energy of the low-band signal radiatedby the radiating patch 118 may be received by the high-band patch 112and the parasitic elements 114-117, or a combination of the high-bandpatch 152 and the parasitic element 154, or a combination of thehigh-band patch 112, and the parasitic elements 114-117 and 164-167, ora combination of the parasitic patch 172 and the parasitic elements174-177 and 184-187. Other examples of combinations of patch andparasitic element(s) may be used. As the high-band patch 112 and theparasitic elements 114-117 receive the low-band signal wirelessly, thehigh-band patch 112 and the parasitic elements 114-117 parasiticallyreceive the low-band signal. The combination of the high-band patch 112and the parasitic elements 114-117 receives the low-band signal eventhough the combination of the high-band patch 112 and the parasiticelements 114-117 receives less than all of the energy of the low-bandsignal radiated by the radiating patch 118.

At stage 260, the method 250 includes re-radiating the low-band signalfrom the combination of the high-band patch and the at least oneparasitic element. For example, the high-band patch 112 in combinationwith the parasitic elements 114-117 may radiate energy due to receivingthe low-band signal, and thus re-radiates the low-band signal althoughthe combination of the high-band patch 112 and the parasitic elements114-117 radiates less than all of the energy of the low-band signalreceived from the radiating patch 118. If only one low-band signal isreceived from the radiating patch 118, then less than all of theparasitic elements 114-117 (i.e., only the parasitic elements 114-117corresponding to the polarization of the received signal) may re-radiateenergy of the low-band signal. The high-band patch 112 in combinationwith the parasitic elements 114-117 is configured (e.g., shaped andarranged) to re-radiate low-band energy in each of the low-bandpolarizations radiated by the radiating patch 118. As other examples,the high-band patch 152 in combination with the parasitic element 154,or the high-band patch 112 in combination with the parasitic elements114-117 and the further parasitic elements 164-167, or the combinationof the parasitic patch 172 and the parasitic elements 174-177 and184-187 re-radiates each of the low-band signals received from theradiating patch 118, in corresponding polarizations.

Other Considerations

The techniques and discussed above are examples, and not exhaustive.Configurations other than those discussed may be used.

As used herein, “or” as used in a list of items prefaced by “at leastone of” or prefaced by “one or more of” indicates a disjunctive listsuch that, for example, a list of “at least one of A, B, or C,” or alist of “one or more of A, B, or C” means A or B or C or AB or AC or BCor ABC (i.e., A and B and C), or combinations with more than one feature(e.g., AA, AAB, ABBC, etc.).

The systems and devices discussed above are examples. Variousconfigurations may omit, substitute, or add various procedures orcomponents as appropriate. For instance, features described with respectto certain configurations may be combined in various otherconfigurations. Different aspects and elements of the configurations maybe combined in a similar manner. Also, technology evolves and, thus,many of the elements are examples and do not limit the scope of thedisclosure or claims.

Specific details are given in the description to provide a thoroughunderstanding of example configurations (including implementations).However, configurations may be practiced without these specific details.For example, well-known circuits, processes, algorithms, structures, andtechniques have been shown without unnecessary detail in order to avoidobscuring the configurations. This description provides exampleconfigurations only, and does not limit the scope, applicability, orconfigurations of the claims. Rather, the preceding description of theconfigurations provides a description for implementing describedtechniques. Various changes may be made in the function and arrangementof elements without departing from the spirit or scope of thedisclosure.

Further, more than one invention may be disclosed.

1. An antenna system comprising: a patch radiator being electricallyconductive and configured to radiate energy in a first frequency bandand a second frequency band, different from the first frequency band; aparasitic patch radiator overlapping with the patch radiator, theparasitic patch radiator being electrically conductive and beingconfigured to radiate energy in the first frequency band; and at leastone parasitic element comprising a conductor sized and disposed relativeto the parasitic patch radiator such that a combination of the parasiticpatch radiator and the at least one parasitic element will radiateenergy in the second frequency band.
 2. The system of claim 1, wherein alowest frequency in the first frequency band is at least 10% higher thana highest frequency in the second frequency band.
 3. The system of claim1, wherein the at least one parasitic element comprises at least oneconductor disposed adjacent to each edge of the parasitic patchradiator.
 4. The system of claim 3, wherein: the parasitic patchradiator is square, configured to radiate energy in the first frequencyband in at least one of two orthogonal polarizations, and centeredrelative to the patch radiator; and the at least one parasitic elementis symmetrically disposed and configured relative to the parasitic patchradiator such that the combination of the parasitic patch radiator andthe at least one parasitic element will radiate energy in the secondfrequency band in at least one of the two orthogonal polarizations. 5.The system of claim 3, wherein the at least one parasitic elementfurther comprises a further conductor disposed is a region diagonallyadjacent each corner of the parasitic patch radiator.
 6. The system ofclaim 3, wherein the at least one parasitic element comprises aconductive loop disposed around the parasitic patch radiator.
 7. Thesystem of claim 1, wherein the patch radiator is disposed in a firstlayer of the system, and the parasitic patch radiator and the at leastone parasitic element are disposed in a second layer of the system,different from the first layer of the system.
 8. The system of claim 7,wherein the parasitic patch radiator is a first parasitic patchradiator, the system further comprising a second parasitic patchradiator disposed in a third layer of the system, the third layer beingdifferent from the first layer and the second layer, the secondparasitic patch radiator being configured to radiate energy in thesecond frequency band.
 9. The system of claim 8, wherein the firstparasitic patch radiator is disposed on a first side of the patchradiator and the second parasitic patch radiator is disposed on a secondside, and overlapping with, the patch radiator.
 10. The system of claim1, comprising a plurality of parasitic elements, wherein the parasiticpatch radiator and the plurality of parasitic elements are disposedsymmetrically about a center point.
 11. The system of claim 1, whereinthe patch radiator is one of a plurality of patch radiators disposed inan array, and wherein the parasitic patch radiator and the at least oneparasitic element are components of the array configured and disposed toparasitically couple to the plurality of patch radiators, wherein thereare more parasitic patches than patch radiators in the array.
 12. Amulti-layer antenna system comprising: a multi-layered circuit board; afeed line configured to convey electricity; a patch radiator coupled tothe feed line, the patch radiator being electrically conductive, havinga rectangular shape, being disposed in a first layer of themulti-layered circuit board, and being configured to radiate energy in afirst frequency band and a second frequency band different from thefirst frequency band; a parasitic patch radiator disposed in a secondlayer of the multi-layered circuit board, the patch radiator and theparasitic patch radiator overlapping, the parasitic patch radiator beingelectrically conductive, having a rectangular shape, having a firstedge, a second edge, a third edge, and a fourth edge, each of the thirdedge and the fourth edge extending between the first edge and the secondedge and having a first electrical length between 0.4 and 0.6wavelengths, in a substrate of the multi-layered circuit board, in thefirst frequency band; and at least one parasitic element comprising afirst conductor disposed adjacent to the first edge of the parasiticpatch radiator and a second conductor disposed adjacent to the secondedge of the parasitic patch radiator.
 13. The system of claim 12,wherein the parasitic patch radiator and the at least one parasiticelement are disposed and configured to, in combination, provide anelectrical length between 0.4 and 0.6 wavelengths in the substrate inthe second frequency band to radiate energy in the second frequencyband, a lowest frequency in the first frequency band being at least 10%higher than a highest frequency in the second frequency band.
 14. Thesystem of claim 13, wherein: the parasitic patch radiator is square; theat least one parasitic element further comprises a third conductordisposed adjacent to the third edge of the patch radiator and a fourthconductor disposed adjacent to the fourth edge of the patch radiator;the parasitic patch radiator, the first conductor, and the secondconductor are configured to, in combination, radiate energy in thesecond frequency band in a first polarization; and the parasitic patchradiator, the third conductor, and the fourth conductor are configuredto, in combination, radiate energy in the second frequency band in asecond polarization orthogonal to the first polarization.
 15. The systemof claim 12, wherein the at least one parasitic element comprises atleast four conductive strips each disposed adjacent to a respective oneof the first, second, third, and fourth edges of the parasitic patchradiator.
 16. The system of claim 15, wherein the at least one parasiticelement further comprises square conductors each aligned with two of thefour conductive strips.
 17. The system of claim 12, wherein the at leastone parasitic element comprises a conductive ring disposed around theparasitic patch radiator.
 18. The system of claim 12, wherein theparasitic patch radiator is a first parasitic patch radiator, the systemfurther comprising a second parasitic patch radiator disposed in a thirdlayer of the multi-layered circuit board and configured to radiateenergy in the second frequency band.
 19. The system of claim 12, whereinthe at least one parasitic element is disposed in the second layer ofthe multi-layered circuit board.
 20. An antenna system comprising: amulti-layered circuit board; a feed line configured to conveyelectricity; a patch radiator coupled to the feed line, the patchradiator being electrically conductive, being disposed in a first layerof the multi-layered circuit board, and being configured to radiateenergy at a first frequency and at a second frequency, the firstfrequency and the second frequency being separated by more than 5 GHz;and a plurality of parasitic patches disposed in a second layer of themulti-layered circuit board, the plurality of parasitic patchesconfigured to receive first energy at the first frequency from the patchradiator and to re-radiate at least a portion of the first receivedenergy at the first frequency, and configured to receive second energyat the second frequency from the patch radiator and to re-radiate atleast a portion of the second received energy at the second frequency.21. The system of claim 20, wherein the plurality of parasitic patchesare symmetric about a center point.
 22. The system of claim 21, whereinthe plurality of parasitic patches comprise four square patches eachpartially overlapping the patch radiator.
 23. The system of claim 21,wherein the center point is a center point of the patch radiator. 24.The system of claim 21, wherein the first frequency is separated fromthe second frequency by approximately 11 GHz.
 25. An antenna systemcomprising: feed means for providing a first signal in a first frequencyband and a second signal in a second frequency band; first radiatingmeans, electrically coupled to the feed means, for radiating, in thefirst frequency band, the first signal received from the feed means, andfor radiating, in the second frequency band, the second signal receivedfrom the feed means; second radiating means for parasitically receivingthe first signal from the first radiating means and radiating, in thefirst frequency band, the first signal in the first frequency band; andthird radiating means for parasitically receiving, in combination withthe second radiating means, the second signal in the second frequencyband and for radiating, in combination with the second radiating means,the second signal in the second frequency band.
 26. The system of claim25, wherein the third radiating means are for parasitically receiving,in combination with the second radiating means, the second signal in thesecond frequency band from the first radiating means.
 27. The system ofclaim 25, wherein a lowest frequency in the first frequency band is atleast 10% higher than a highest frequency in the second frequency band.28. The system of claim 25, wherein the second radiating means and thethird radiating means are disposed in a first layer of a multi-layercircuit board.
 29. The system of claim 28, further comprising fourthradiating means for parasitically receiving the second signal in thesecond frequency band from the first radiating means and for radiatingthe second signal in the second frequency band, wherein the fourthradiating means are disposed in a second layer, different from the firstlayer, of the multi-layer circuit board.
 30. The system of claim 28,wherein: the second radiating means are for radiating the first signalin two orthogonal polarizations; and the third radiating means aresymmetrically disposed about the second radiating means and are for, incombination with the second radiating means, radiating the second signalin the two orthogonal polarizations.